Equipment List
Equipment List Every capability we quote is backed by named machines. This page lists our production, inspection and reliability equipment stage by stage, with the key specification and the machine count stated line by line - so you can confirm capacity before you place an order, or cite the figures during a supplier audit. It covers the full PCB and PCBA flow, from CAM engineering through to final packing. Specified line by line Each stage lists the equipment, its key specification and how many units are running. Audit ready Use the published figures in capability questionnaires and on-site supplier audits. PCB and PCBA in one list Fabrication, assembly, electrical test and reliability equipment together. Jump straight to a stage The index below takes you directly to the process you are assessing. 11 Production stages listed From CAM engineering to packing 32 Max layer count Multilayer and HDI capability 3/3 mil Min line width Outer layer fine-line capability Jump to a production stage Eleven stages, each with its own equipment table. Counts and specifications are stated per stage. Turns customer data into production-ready tooling, with DFM checks before release. Imaging, developing and etching of the inner copper layers, verified by AOI. Builds the multilayer stack under vacuum, then registers every layer by X-ray. Mechanical and laser drilling for through holes, blind and buried vias and back-drilled stubs. Copper deposition and outer layer imaging, from PTH to finished outer traces. Solder mask application, imaging and cure, plus legend printing and via plugging. Final pad finish selection and control, with plating thickness verified per lot. Board outline, scoring and edge finishing to the tolerance your assembly line needs. 100% network test on every order, plus controlled impedance verification. Optical, X-ray and laboratory equipment that supports final QC and reliability testing. ESD-safe packing and traceable storage, so boards arrive in the condition they were tested. The laser line that opens the microvias a high-density stack needs. It runs alongside the mechanical drilling fleet, so blind and buried vias are drilled, cleaned and inspected in the same flow rather than being sent outside. 2 × 2 Laser spindles (peer class) 3 mil Min laser-drilled via 2 Lines in operation (peer) Builds the multilayer stack under vacuum, in one or more press cycles. Sequential lamination lets a high-layer-count board be built in stages instead of one pass. 4 hot / 2 cold Press openings (peer class) Up to 40 Layer capability 3 Presses in operation (peer) Exposes inner and outer layers straight from the CAM data, with no film in the loop. That removes film-related distortion and holds registration tight on fine-line layers - the imaging used on the production-process page. 3/3 mil Min line width & space 2 mil Layer registration 4 CCD Automatic alignment Every order leaves with a 100% network test. Flying probes carry prototypes and small batches where a dedicated fixture is not economical; universal testers take over once volume justifies the fixture. 8-axis Flying probe class 7 auto + 8 manual Universal testers TDR ±5% Impedance verification Inspection & reliability equipment Inspection here is not a final gate - it runs alongside the stages above. Pattern, material, plating and durability are each checked on dedicated equipment, and the readings are recorded per order. That is what makes a re-order years later repeat the same process rather than an approximation of it.How to read this equipment list
Engineering & CAM
Equipment Key specification Qty Supports CAM / DFM software platform Genesis 2000 / InCAM / ParCAM class CAM suite n/a DFM review LDI laser direct imaging LDI, thin-core capable 2 Fine-line imaging Laser photo plotter Laser photo plotter, EIE class 4 Artwork generation AOI verification station AOI + VRS review station 1 Data verification Automatic cutting machine Auto diamond saw cutting, thin core 2 Panel preparation Inner Layer
Equipment Key specification Qty Supports Automatic pre-treatment line Thin core pre-treatment line 2 Inner layer imaging Auto laminator / roller coater Auto roller coating / dry film lamination 2 Fine-line imaging LDI exposure machine LDI / auto UV exposure, 4 CCD alignment 4 Registration accuracy Etching & stripping line (DES) DES line, 2 mil / 3 mil class 2 Fine-line etching Inner layer AOI AOI + VRS 1 Defect screening Lamination
Equipment Key specification Qty Supports Brown / black oxide line Automatic black oxide line 1 Layer adhesion Riveting & lay-up station Auto lay-up, riveting, PP punching 2 Multilayer & HDI Vacuum lamination press Vacuum press, 4 hot / 2 cold openings 3 High layer count X-ray target drilling machine X-ray targeting & drilling 1 Layer registration Automatic return line Auto loading / unloading, return press line 1 Process flow Drilling
Equipment Key specification Qty Supports CNC mechanical drilling machine CNC drilling, 138-spindle class 60 Through-hole drilling UV laser drilling machineML706GTW6 Laser drilling, 2 x 2 spindles 2 Microvia & HDI Deburring line Auto deburr + brush mill line 2 Hole quality Hole inspection equipment Hole counter / automatic measuring 1 Hole verification Plating & Pattern Transfer
Equipment Key specification Qty Supports PTH / chemical copper line Desmear & PTH, aspect ratio 25:1 (max 40:1) 2 Plated through holes Panel plating line 1st copper plating (panel), vertical line 1 Copper thickness control Pattern plating line 2nd copper plating (pattern), copper-filled BVH 2 Fine-line plating Outer layer laminating machine Automatic dry film laminator 3 Outer layer imaging Exposure machine Auto / semi-auto UV exposure, 4 CCD alignment 4 Registration accuracy Outer layer etching line Etching line, line width tolerance ±10% 1 Fine-line etching Outer layer AOI AOI + VRS 1 Defect screening Solder Mask & Legend
Equipment Key specification Qty Supports Solder mask pre-treatment line Scrubbing + pumice treatment line 4 Solder mask colours Electrostatic spray / screen printer Semi-auto / double-table printing 4 Mask uniformity Solder mask exposure machine Auto UV exposure, 4 CCD alignment 3 Mask registration Developing & post-cure line Developing + post cure line 2 Mask adhesion Legend inkjet printer Legend printing, min 5 mil line width 4 Legend clarity Via plugging machine Vacuum resin plugging, via 0.2-0.8 mm — Via in pad Surface Finish
Equipment Key specification Qty Supports ENIG line Immersion gold (ENIG) — ENIG finish ENEPIG line ENEPIG (Ni / Pd / Au) — ENEPIG finish OSP line OSP line 2 OSP finish HASL / lead-free HASL line HASL & lead-free HASL 1 HASL finish Gold finger plating line Gold finger / selective hard gold — Hard gold Coating thickness measurement Copper & film thickness gauge 2 Finish thickness Routing & Profile
Equipment Key specification Qty Supports CNC routing machine CNC routing, 54-spindle class 12 Board outline V-cut scoring machine Auto V-scoring, min residual 0.1 mm 4 Panel scoring Beveling machine Edge beveling machine 1 Gold finger bevel Cleaning line Ultrasonic final cleaning line — Surface cleanliness Electrical Test
Equipment Key specification Qty Supports Universal / fixture tester Universal tester, LMx2 / CLx4 class 7 100% network test Flying probe tester Flying probe, 8-axis class 4 Prototype & small batch TDR impedance test system TDR (HP 54754A class), impedance ±5% 1 Impedance control Test program engineering Dedicated & flying probe test programs n/a NPI support Inspection & Reliability
Equipment Key specification Qty Supports AOI Double-sided high-speed AOI 1 Visual inspection X-ray inspection X-ray inspection of buried features — Buried features Metallographic microscope (microsection) Microsection / metallography 2 Cross section Ionic contamination test Ionic contamination (ROSE) test — Cleanliness Solderability test Solderability test — Assembly readiness Thermal shock / humidity chamber Thermal shock 5 x 10 s @ 288 °C — Reliability testing Image measuring instrument 2-D video measurement / vision measuring 1 Dimensional check Copper thickness & line width measurement Line width ±10%, copper thickness control 1 Process control Salt spray chamber Salt spray / corrosion test — Corrosion resistance Packing & Warehousing
Equipment Key specification Qty Supports Vacuum packing machine Vacuum packing, desiccant + humidity indicator 2 Moisture protection ESD packing line ESD-safe packing line 2 ESD control Temperature & humidity controlled warehouse Temperature & humidity controlled warehouse — Storage control Finished goods & traceability system Finished goods & traceability system — Lot traceability 
UV laser drilling lineML706GTW6
Vacuum lamination press
LDI laser direct imaging
Flying probe and universal test
Equipment Key specification Qty Pattern & layer integrity AOI Double-sided high-speed AOI 1 X-ray inspection X-ray inspection of buried features — Material & build integrity Metallographic microscope (microsection) Microsection / metallography 2 Ionic contamination test Ionic contamination (ROSE) test — Solderability test Solderability test — Durability & environment Thermal shock / humidity chamber Thermal shock 5 x 10 s @ 288 °C — Salt spray chamber Salt spray / corrosion test — Dimensions & plating Image measuring instrument 2-D video measurement / vision measuring 1 Copper thickness & line width measurement Line width ±10%, copper thickness control 1 
