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led pcb board Printed circuit board, Custom Circuit Boards china, oem pcb board manufacturer china
- PCB P/N: 104_DCP_R2
- Layer Count: 4L
- Material: FR-4 TG130
- Board thk: 1.6mm
- copper thk: 1/1/1/1oz
- Smallest hole size: 0.3MM
- No. of holes (pcs): 295
- line w/s: 12/8mil
- Impedance control. Y / N (Tol %): N
- Surface Finishing:LF-HASL
- Sn: 1-40UM
O-Leading strives to be your one stop solution partner in EMS supply chain, including PCB design , PCB fabrication and PCB assembly (PCBA).We provide some of the most advanced PCB technology, including HDI PCBs,multilayer PCBs, Rigid-Flexible PCBs.We can support from quick turn prototype to medium & mass Production.
In general, our global customers are very impressed with our services:rapid response, competitive price and quality commitment.Providing more valuable technical service and overall solution is the way O-leading forward. (led pcb board Printed circuit board) Looking to the future, O-leading will concentrate on the innovation and development of electronics manufacturing technology as always, and make persistent efforts on PCB & PCBA one-stop service to provide first-class services and create more value for our customers.
PLEASE CLICK THESE FOR MORE INFORMATION:Custom Circuit Boards china
 
  
 
PCB Production Capabilities
Layer Count: 1Layer-32Layer
Finished copper thickness： 1/3oz-12oz Min Line width/spacing internal： 3.0mil/3.0mil Min Line width/spacing external: 4.0mil/4.0mil Max Aspect Ratio: 10:1 Board thickness： 0.2mm-5.0mm Max Panel size(inches): 635*1500mm Minimum Drilled Hole Size: 4mil PIated Hole Tolerance: +/-3mil BIind/Buried Vias (AII Types): YES Via Fill(Conductive,Non-Conductive): YES Base Material: FR-4,FR-4high Tg.Halogen free material,Rogers,Aluminium base,Polyimide, Heavy Copper
Surface finishes: HASL,OSP,ENIG,HAL-LF,lmmersion silver,lmmersion Tin,Gold fingers,Carbon ink
SMT Production Capabilities
PCB Material: FR-4,CEM-1,CEM-3,Aluminum-based board Max PCB size: 510x460mm Min PCB size：50x50mm PCB Thickness：0.5mm-4.5mm Board thickness：0.5-4mm Min Components size: 0201 Standard chip size component: 0603 and larger Component max height：15mm Min lead pitch: 0.3mm Min BGA ball pitch:0.4mm Placement precision: +/-0.03mm |
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