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FAX: + 86-4008892163-239121
+ 86-2028819702-239121
Email: sales@o-leading.com
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china pcb manufacturer, power bank pcb board Printed, HDI pcb Printed circuit board
- PCB P/N:104_DCP_R2
- Layer Count:4L
- Material:FR-4 TG130
- Board thk:1.6mm
- copper thk:1/1/1/1oz
- Smallest hole size:0.3MM
- No. of holes (pcs):295
- line w/s:12/8mil
- Impedance control. Y / N (Tol %):N
- Surface Finishing:ENIG Au:0.05-0.10UM
- Solder Mask Silkscreen:Green
- Single board size:Dim X (mm):80;Dim Y (mm):116
- Panelisation:Dim X (mm):80;Dim Y (mm):116;No Of UPS:1
- Special:peelable mask:N
- Routing/Punching:CNC
| Welcome to O-leading |
| Product Description |
| Place of Origin | Guang dong, China (Mainland) | Brand Name | O-Leading |
| Base Material | FR-4,,Aluminum | Copper Thickness | 0.5oz-5oz |
| Min. Hole Size | 0.2mm | Min. Line Width | 0.2mm |
| Surface Finishing | immersion gold ,OSP,lead free HASL | Min. Line Spacing | 0.2mm |
| applicable to | led,mobile phone,air conditioners,washing machines | character | Industrial Control pcb |
| certificates | ISO9001,UL,RoHS,SGS | Q/CTN | 10PCS-100PCS |
| weight | 0.01kg -5kg | MOQ | 10pcs |
| color | blue ,red ,green,black.yellow | Board Thickness | 0.1-5mm |
| Model Number | power bank pcb assembly pcba manufacturer | price | $0.1-$10 |
| desigh type | client requirement | size | 0.01m3-10m3 |
Production Capability
16 years professional OEM pcb board manufacture
|
item |
2014 |
2015~2016 |
2017~2018 |
|||
|
Volume |
Sample |
Volume |
Sample |
Volume |
Sample |
|
|
Layer count |
32 |
42 |
38 |
44 |
42 |
48 |
|
Min Line/space (μm) |
50/50 |
40/45 |
40/45 |
40/40 |
35/40 |
35/35 |
|
Min drill hole |
0.15 |
0.10 |
0.15 |
0.10 |
0.15 |
0.10 |
|
Aspect ratio |
14:1 |
16:1 |
16:1 |
18:1 |
18:1 |
20:1 |
|
N+C+N |
4+C+4 |
5+C+5 |
5+C+5 |
6+C+6 |
5+C+5 |
6+C+6 |
|
Any layer interconnection |
5+2+5 |
6+2+6 |
5+2+5 |
6+2+6 |
5+2+5 |
6+2+6 |
|
Plate filling via |
YES |
-- |
YES |
-- |
YES |
-- |
|
Min. core thickness (exclude copper) (μm) |
50 |
40 |
40 |
30 |
40 |
30 |
|
Min. Laser Drill diameter (μm) |
75 |
65 |
65 |
50 |
50 |
40 |
|
Via on buried |
YES |
-- |
YES |
-- |
YES |
-- |
|
Material |
FR4, Megtron, Nelco, Rogers, Heavy Copper, etc. |
|||||
|
Embedded capacitor PCB
|
YES |
-- |
YES |
-- |
YES |
-- |
|
Surface Process |
Lead-free HASL, ENIG, OSP, Immersion silver, Immersion tin, |
|||||
| Our Team |
| Certifications |
| Packaging & Delivery |
| Process Capability |
Layer Count: 1Layer-32Layer
Finished copper thickness： 1/3oz-12oz
Min Line width/spacing internal： 3.0mil/3.0mil
Min Line width/spacing external: 4.0mil/4.0mil
Max Aspect Ratio: 10:1
Board thickness： 0.2mm-5.0mm
Max Panel size(inches): 635*1500mm
Minimum Drilled Hole Size: 4mil
PIated Hole Tolerance: +/-3mil
BIind/Buried Vias (AII Types): YES
Via Fill(Conductive,Non-Conductive): YES
Base Material: FR-4,FR-4high Tg.Halogen free material,Rogers,Aluminium base,Polyimide,
PCB Material: FR-4,CEM-1,CEM-3,Aluminum-based board
Max PCB size: 510x460mm
Min PCB size：50x50mm
PCB Thickness：0.5mm-4.5mm
Board thickness：0.5-4mm
Min Components size: 0201
Standard chip size component: 0603 and larger
Component max height：15mm
Min lead pitch: 0.3mm
Min BGA ball pitch:0.4mm
Placement precision: +/-0.03mm
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