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Base Material Megtron 6, used for 25Gbps Line card Project, high frequency PCB, Immersion Gold, blind/buried via holes, Back drill, Rotated 7 degree
- Layer count: 18L
- materials: M6
- Board thickness: 3.0+/-0.3mm
- Finishing Size: 210x395.2mm
- Min Line w/s: 3.2/3.5mil
- Min drill size [FHS/DHS] : 0.20mm/0.30mm
- Plating AR DHS : 11.7:1
- Hard gold thickness: 4UM
- Surface finish: ENIG
- Impedance: Tol: +/-7%, the deviation of the impedance in the same layer must not exceed +/- 2Ohm
- Other : Back drill, Rotated 7 degree.
COPPER PLATE HOLES MINIMUM .025 AVG, .020 MIN.. HOLES MAY NOT BE PLUGGED, china Pcb design company
•Special requirement:ENIG, Hard gold thickness: 4UM, Impedance: Tol: +/-7%, the deviation of the impedance in the same layer must not exceed +/- 2Ohm, Back drill, Rotated 7 degree.
Pack with colorless transparent bubble film ,25 PCS/ bag, put desiccant in flank, put humidity indicator card on top side
Layer structure
•Special requirement:ENIG, Hard gold thickness: 4UM, Impedance: Tol: +/-7%, the deviation of the impedance in the same layer must not exceed +/- 2Ohm, Back drill, Rotated 7 degree.
Pack with colorless transparent bubble film ,25 PCS/ bag, put desiccant in flank, put humidity indicator card on top side
Layer structure
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