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Black solder mask pcb with half plated holeBlack solder mask pcb with half plated hole

Black solder mask pcb with half plated hole

  • PCB P/N:Black solder mask pcb with half plated hole
  • Layer Count:4L
  • Material:FR-4 TG170
  • Board thk:1.6mm
  • copper thk:1/1/1/1oz
  • Smallest hole size:0.3MM
  • No. of holes (pcs):98
  • line w/s:5/5mil
Welcome to O-leading

O-Leading strives to be your one stop solution partner in EMS supply chain, including PCB design , PCB fabrication and PCB assembly (PCBA).We provide some of the most advanced PCB technology, including HDI PCBs,multilayer PCBs, Rigid-Flexible PCBs.We can support from quick turn prototype to medium & mass Production. (Multilayer pcb Printed company)

In general, our global customers are very impressed with our services:rapid response, competitive price and quality commitment.Providing more valuable technical service and overall solution is the way O-leading forward. 

Looking to the future, O-leading will concentrate on the innovation and development of electronics manufacturing technology as always, and make persistent efforts on PCB & PCBA one-stop service to provide first-class services and create more value for our customers.

We are professional PCB manufacturer with more than ten years experiences . Products range-single, double side ,multi-layer PCB ,flexible PCB and MCPCB.We can provide fast prototype service – S/S in 24hrs , 4-8layers in 48-96 working hrs production time. 

COPPER PLATE HOLES MINIMUM .025 AVG, .020 MIN.. HOLES MAY NOT BE PLUGGED 

Pack with colorless transparent bubble film ,25 PCS/ bag, put desiccant in flank, put humidity  indicator card on top side


Product Description

PCB P/N  Black solder mask pcb with half plated hole 
Layer Count  4L 
Material  FR-4 TG170 
Board thk  1.6mm 
copper thk  1/1/1/1oz 
Smallest hole size  0.3mm 
No. of holes (pcs)  98 
line w/s  5/5mil 
Impedance control. Y / N (Tol %) 
Surface Finishin ENIG    Au:0.05-0.10UM 
Solder Mask Silkscreen  Black / White 
Single board size  Dim X (mm):21;Dim Y (mm):12 
Panelisation  Dim X (mm):90;Dim Y (mm):68;No Of UPS:16 
Special:peelable mask  N 
Routing/Punching  CNC 



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     Process Capability

    PCB Production Capabilities
    Layer Count: 1Layer-32Layer
    Finished copper thickness: 1/3oz-12oz
    Min Line width/spacing internal: 3.0mil/3.0mil
    Min Line width/spacing external:  4.0mil/4.0mil
    Max Aspect Ratio:  10:1
    Board thickness: 0.2mm-5.0mm
    Max Panel size(inches):  635*1500mm
    Minimum Drilled Hole Size:  4mil
    PIated Hole Tolerance:  +/-3mil
    BIind/Buried Vias (AII Types):  YES
    Via Fill(Conductive,Non-Conductive): YES
    Base Material: FR-4,FR-4high Tg.Halogen free material,Rogers,Aluminium base,Polyimide,
                  Heavy Copper
    Surface finishes: HASL,OSP,ENIG,HAL-LF,lmmersion silver,lmmersion Tin,Gold fingers,Carbon ink

    SMT Production Capabilities
    PCB Material:  FR-4,CEM-1,CEM-3,Aluminum-based board
    Max PCB size: 510x460mm
    Min PCB size:50x50mm
    PCB Thickness:0.5mm-4.5mm
    Board thickness:0.5-4mm
    Min Components size: 0201
    Standard chip size component:  0603 and larger
    Component max height:15mm
    Min lead pitch: 0.3mm
    Min BGA ball pitch:0.4mm
    Placement precision:  +/-0.03mm


    O-LEADING SUPPLY CHAIN

    Tel:+86-0752-8457668

    Contact Person:Mrs.Fancy

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